http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110049168-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2009-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4120978a866459e75d4230290bf4264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5fa2238effef3a0b275af64194d9dfd |
| publicationDate | 2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110049168-A |
| titleOfInvention | Liquid adhesive composition for semiconductor device and semiconductor device using same |
| abstract | The present invention relates to a liquid adhesive composition for a semiconductor device, the liquid adhesive composition for a semiconductor device of the present invention comprises an epoxy resin having a softening point of 50 ℃ or more; Curing agent; A solvent in which the epoxy resin and the curing agent are dissolved but a boiling point of 150 ° C. or more; And a polymer resin having a molecular weight of 1,000 to 50,000 capable of reacting with the cured product in which the epoxy resin, the curing agent, and the solvent are mixed. When the adhesive layer is formed on the rear surface of the semiconductor wafer using the liquid adhesive composition for semiconductor devices, it may exhibit good room temperature stability, excellent adhesion, and mechanical strength. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10526513-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015093794-A1 |
| priorityDate | 2009-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.