| abstract |
Curable resin composition which expresses excellent heat resistance, low thermal expansion, and realizes good solvent solubility, its hardened | cured material, the printed wiring board which consists of this composition, the novel epoxy resin which gives these performances, and its manufacture Provide a method. Curable property characterized in that a naphthalene structure and a cyclohexadienone structure have a methylene group in a molecular structure, and an epoxy resin (A) and a hardening | curing agent (B) which have a nodular skeleton, a glycidyloxy group, and a hardening | curing agent are essential components. Resin composition. |