patent/KR-20110042336-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110042336-A

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
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filingDate	2009-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2629c60a7790eded9cef7cdb4a713c23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaa1f95e359fb14a0a901a935e953937 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d7bedaa356a4dd03d5feddb5c4bab34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03118eab7f350a0a5505a98589fbab3f
publicationDate	2011-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20110042336-A
titleOfInvention	Under bump metallization for on-die capacitors
abstract	Various on-chip capacitors and methods of manufacturing the same are disclosed. In one embodiment, a method of fabricating a capacitor is provided that includes forming a first conductor structure on a semiconductor chip and forming a passivation structure on the first conductor structure. An under bump metallization structure is formed on the passivation structure. The under bump metallization structure overlaps at least a portion of the first conductor structure to provide a capacitor.
priorityDate	2008-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609

Total number of triples: 85.