http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110042175-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10962 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09754 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21Y101-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21V17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21S2-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2009-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b2a48a6114bf5af2291ac3a4c928d13 |
| publicationDate | 2011-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110042175-A |
| titleOfInvention | Support module for solid state light source, lighting device including the module, and manufacturing method of the lighting device |
| abstract | A support module 1 comprising a conductive layer 2 having a through hole 5 and a receiving surface configured to receive a solid light source 3 having an electrical contact pad 4 aligned with the through hole 5. ) Is provided. The support module 1 further comprises an electrical insulation 8 and at least one contact pin 9 which extends through the electrical insulation 8 and protrudes through the through hole 5. In addition, the electrical insulator 8 is provided with an electrical contact pad of the solid state light source 3 which is received by the surface of the conductive layer 2 and the channel 10 allowing access to the ends of the contact pins 9. 4). This channel makes it possible to reach the end of the contact pin and the contact pad through the insulation using a soldering tool. Thus, it is possible to attach a solid light source on the metal surface by soldering the contact pins to the contact pads. Since the heat dissipation characteristics of the metal surface are superior to the heat dissipation characteristics of the substrate for a printed wiring circuit, it is advantageous to mount a solid state lighting device on the metal surface for applications requiring excellent heat dissipation characteristics. |
| priorityDate | 2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159990 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452055648 |
Total number of triples: 26.