| abstract |
The epoxy resin composition for semiconductor encapsulation of the present invention, (A) crystalline epoxy resin, (B) the following formula (1) [Formula 1] (R 1 and R 2 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, and a plurality of R 1 's or a plurality of R 2' s may be the same as or different from each other. A is an integer of 0 to 4 and b is 0 to 4 An integer, c is an integer of 0 to 3. n is an average value of 0 to 10. (C) a (co) polymer or a derivative thereof comprising a structural unit derived from butadiene, and (D) an inorganic filler contained in the total epoxy resin composition of 80% by weight or more and 95% by weight or less. |