| abstract |
The present invention provides a stacked solid state drive and a method of manufacturing the same, which can reduce the size by mounting semiconductor chips in a recessed region formed in a substrate. A stacked solid state drive of the present invention comprises: a substrate comprising one or more recessed regions; One or more passive elements mounted in one or more recessed regions; One or more control semiconductor chips mounted in one or more recessed regions; One or more nonvolatile memory semiconductor chips mounted on the first surface of the substrate to overlap and stack one or more passive elements, one or more control semiconductor chips, or both; And an external connection terminal located at one side of the substrate.n n n n Solid State Drives, SSDs, Recesses, Stacked, Nonvolatile Memory |