http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110039127-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2009-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34e21bd2bdcbd3d342b1d4715f841f9c |
| publicationDate | 2011-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110039127-A |
| titleOfInvention | Chip on film package and manufacturing method thereof |
| abstract | The present invention relates to a chip-on film package and a method of manufacturing the same. Specifically, an electronic device chip having an input / output connection part having at least one active surface formed thereon and a circuit pattern which is an input / output terminal pattern corresponding to the input / output connection part. Comprising a tab tape (TAB Tape) having a, characterized in that at least one heat dissipation hole (PJH; Pass Joint Hole) (PJH) is formed in the tab tape corresponding to the electronic device chip mounting area.n n n According to the present invention, when manufacturing a chip on film (Chip On Flim) package, through the process of forming a heat dissipation hole (PJH) in the mounting portion of the electronic device chip efficiently heat generated in the electronic device chip By releasing to the outside, the temperature of the chip is lowered, thereby reducing the defective rate due to heat of the electronic device chip.n n n n Chip On Flim Package, Pass Joint Hole |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013047963-A1 |
| priorityDate | 2009-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.