Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b822ee046eb6c45d1e3bd9ce9c1782e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-2283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07749 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822 |
filingDate |
2009-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6295192012e7b0ed39e88002b8734a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bb761a089dba691e10fe050a316ea73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21747acfb77b0d181ab4dff0d66658d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eee9961b51571967dc67c5e29fc67329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f457e7dc5f3c1a3cf1666f0a67cb5861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89ce31d3641e61d30984549171309fd4 |
publicationDate |
2011-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20110031283-A |
titleOfInvention |
Semiconductor device |
abstract |
An object of the present invention is to provide a highly reliable semiconductor device that is resistant to external stress and electrostatic discharge while achieving thinness and miniaturization. Another object of the present invention is to prevent a defect in shape or characteristics due to external stress or electrostatic discharge in a manufacturing process and to manufacture a semiconductor device with good yield. A first insulator and a second insulator provided to face each other, a semiconductor integrated circuit and an antenna provided between the opposing first insulator and a second insulator, a conductive shield provided on one surface of the first insulator, and one surface of the second insulator The conductive shield installed in the installation is installed. The conductive shield provided on one surface of the first insulator and the conductive shield provided on one surface of the second insulator are electrically connected. |
priorityDate |
2008-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |