http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110030299-A

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
filingDate 2010-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90f37a8576aedbd85d46b86d0a8b142e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66888446ea4fe0a9294689218b837878
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publicationDate 2011-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20110030299-A
titleOfInvention Electroplating method using an electrocopper plating bath and this electrocopper plating bath
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating bath and an electroplating method using the electrocopper plating bath, wherein a substrate having a mixture of through holes and via holes has good adhesion to through holes and hole filling properties to via holes. It is an object of the present invention to provide a favorable electroplating bath and an electroplating method using the electroplating bath. The present invention relates to a poly-polyolefin produced by heat-treating an epichlorohydrin modified product of a polycondensate composed of diethylenetriamine, adipic acid and ε-caprolactam, using water-soluble copper salts, sulfuric acid, and chloride ions as main components. It is characterized by containing an amide polyamine as a leveling agent.
priorityDate 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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