http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110026981-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-08 |
| filingDate | 2009-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_675371b1c7af7c068da26f78356bd092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c5c434074a39843875229668f688b7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f0dad7b725719e104a35200decc5fa2 |
| publicationDate | 2011-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110026981-A |
| titleOfInvention | Etch solution composition for formation of copper wiring |
| abstract | The present invention relates to a wet etchant composition for a multilayer including a copper-based metal film and a titanium-based metal film. The etchant composition of the present invention provides an excellent etching profile during the etching of such a multi-layer, and minimizes damage and residue generation to the glass substrate and the insulating layer below, so that the subsequent process can be performed stably.n n n n Copper, titanium, etchant, inorganic salt, organic acid |
| priorityDate | 2009-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.