| abstract |
Provided are a semiconductor packaging applicable conductive composition using a silver coated material flake as a conductive filler, a curable epoxy, acrylate, bismaleimide drug, or the like, or a combination thereof as an organic resin, and a method of making the same. The composition exhibits desirable workability as a dispensable die attach adhesive having an appropriate range of rheology, viscosity, and physical stability upon storage, excellent reliability in conductivity or corrosion resistance, and can reduce the amount of expensive silver in the composition. |