http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110015430-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42D2033-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42D25-47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42D25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J131-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-04 |
| filingDate | 2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d94606ff2fee8818be1307b663c0d31f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1f29c2715631d3700d6b0b571451ce2 |
| publicationDate | 2011-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110015430-A |
| titleOfInvention | Thermal Curable Adhesives and Resin Stacked IC Cards |
| abstract | <Task> This invention provides the adhesive agent which can adhere | attach the base material which consists of crystalline polyester resin firmly, can adjust the thickness of an adhesive layer freely, is excellent in chemical-resistance, and is excellent in storage stability at the same time. In addition, since it is possible to adhere the substrate made of crystalline polyester resin by using a liquid curable adhesive, which is conventionally considered difficult, to apply the adhesive with high precision by a printing method without molding into a hot-melt-type sheet, A resin laminated IC card having a high degree of freedom in design can be provided. <Solution> A thermosetting adhesive comprising (a) an amorphous polyester resin having a hydroxyl group, (b) a resin having a carboxylic anhydride, and (c) a solvent in which the amorphous polyester resin (a) having the hydroxyl group is dissolved. |
| priorityDate | 2008-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.