| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8896389057e9be1306a662309cac1896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efb5a731e9f6fe2bf77b1158aeff24d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97958c7617122121448259d44335f7a5 |
| publicationDate |
2011-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110008048-A |
| titleOfInvention |
Epoxy Resin Compositions and Molded Products |
| abstract |
The epoxy resin composition which is excellent in moldability and high in thermal conductivity at the time of compounding with an inorganic filler and giving hardened | cured material excellent in low thermal expansion property and heat resistance and moisture resistance is provided. This epoxy resin composition contains (A) epoxy resin and (B) hardening | curing agent, and makes 50 weight% or more of an epoxy resin 4,4'- benzophenone type epoxy resin, and makes 50 weight% or more of a hardening | curing agent 4,4 '. It is an epoxy resin composition which set it as the benzophenone type phenolic resin, and made the equivalence ratio of the epoxy group in epoxy resin and the functional group in a hardening | curing agent within the range of 0.8-1.5. This epoxy resin composition can contain 50-95 wt% of inorganic fillers, and is suitable for semiconductor encapsulation. |
| priorityDate |
2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |