| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d747a758244f04750caa191d6bb879 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 |
| filingDate |
2010-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386b2dc5cd68b306d14228dfa63b2db9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98ff3d4d339120b85a5716c47165d599 |
| publicationDate |
2011-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110006589-A |
| titleOfInvention |
Electrolytic hard gold plating solution and plating method using the same |
| abstract |
In the partial plating process for providing the Ni barrier layer on the connector material, a gold plating solution capable of suppressing the gold plating film formed on the Ni barrier portion is provided. Using an electrolytic hard gold plating solution containing one or two or more compounds selected from the group consisting of gold cyanide and / or salts thereof, organic acid conductive salts, nitro group-containing compounds, carboxylic acids, oxycarboxylic acids, and salts thereof By performing the partial plating process, it is possible to suppress the gold plating film formed of the Ni barrier portion. |
| priorityDate |
2009-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |