| abstract |
The circuit subassembly includes a conductive layer; A dielectric layer formed from a thermosetting composition, the thermosetting composition comprising a polybutadiene or polyisoprene, less than about 1000 ppm ionic contaminants based on the total weight of the thermosetting composition. And about 5 to about 15 percent by weight of the nitrogen-containing compound comprising about 30 to about 70 percent by weight of magnesium hydroxide, and at least about 15 weight percent of nitrogen; and the conductive layer And an adhesive layer disposed between and in contact with the dielectric layer, the adhesive sublayer comprising a poly (arylene ether), the circuit subassembly having a UL-94 rating of at least V-1. Have |