patent/KR-20100127709-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100127709-A

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2010-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dc955b7fdc634f6139bf918b523c049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_202ac6285aef6fc822af8aa4db50dc42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33ca1c8901ebf53d4633e6a22931f097
publicationDate	2010-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20100127709-A
titleOfInvention	Aluminum bond pads with improved wire bond stability
abstract	The electrical device bond pads include an Al layer located over the electrical device substrate. The Al layer contains an intrinsic Group 10 metal therein.
priorityDate	2009-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

Total number of triples: 51.