| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_adb0e564374fedf34b36103d36e6455a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2009-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7544d291f125f9adbbe25c5dedec0b89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fb38137ef0d781ee18d8040bbcc6ef5 |
| publicationDate |
2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100126415-A |
| titleOfInvention |
Heatsinks made of thermally conductive plastics |
| abstract |
The present invention relates to heat sinks for electrical or electronic devices, and processes for manufacturing heat sinks as well as electrical or electronic devices including heat sources and heat sinks. The heat sink is at least 20% of the total weight of the thermally conductive plastic material. Amount of and / or in-plane thermal conductivity of at least 7.5 W / mK And a plastic body made of a thermally conductive plastics material comprising expanded graphite having a carbon dioxide. The heatsink can be made from the thermally conductive plastics material by injection molding the thermally conductive plastics material and then optionally applying a coating layer. In electrical or electronic devices, heatsinks are assembled with the heat source in a thermally conductive communication manner. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210063109-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170040979-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210064459-A |
| priorityDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |