http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100123766-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc3e639586089fe232d0cfb27383c875
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2009-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34d935528da6c4da6f6d0e419bda7ec6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95cb292d80591497a576ad3acc8f25e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d744a53411f2f22b88b22143ebda0651
publicationDate 2010-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20100123766-A
titleOfInvention Method of forming Cu wiring film
abstract In the semiconductor device manufacturing process, in order to provide the formation method of the Cu wiring film using the adhesion layer (base film) which improved the adhesiveness with Cu wiring film, after forming a barrier film on the board | substrate in which the hole etc. are formed, A PVD-Co film, a CVD-Co film, or an ALD-Co film is formed thereon, and the Co film is filled with a CVD-Cu film or a PVD-Cu film in a hole formed on the surface thereof, and then heated at a temperature of 350 ° C. or less. The process forms a Cu wiring film.
priorityDate 2008-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578708
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426

Total number of triples: 22.