http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100118147-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1784eb7fc902d292db30e120ec712d5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-505 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 |
| filingDate | 2009-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52e13ead8a759e5758dbe6026c2fd4d4 |
| publicationDate | 2010-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100118147-A |
| titleOfInvention | Copper alloy tin plating bath with excellent wear resistance, insertability and heat resistance |
| abstract | Tin plating bath which is excellent as abrasion resistance, insertability, and heat resistance as a conductive spring material. Electroplating is performed on the surface of the copper alloy bath in order of base plating and Sn plating, and thereafter, as a plating bath subjected to a reflow process, the difference in altitude between the outermost surface of the Sn plating and the outermost point on the Cu-Sn alloy is 0.1 to 0.5. It is a copper alloy tin plating bath whose maximum height of the roughness curve of a Cu-Sn alloy phase is 0.6-1.2 micrometer, and the average length of the roughness curve of a Cu-Sn alloy phase is 2.0-5.0 micrometers, Preferably it is 2.0 Rsm / (y + Rz) The coating film is comprised from each layer of the Sn layer whose thickness is 0.5-1.5 micrometers, the Cu-Sn alloy layer whose thickness is 0.6-2.0 micrometers, and the Cu layer whose thickness is 0-0.8 micrometer from the surface to a base material, or Or the tin plating tank in which the plating film is comprised by each layer of the Sn layer whose thickness is 0.5-1.5 micrometers, the Cu-Sn layer whose thickness is 0.4-2.0 micrometers, and the Ni layer whose thickness is 0.1-0.8 micrometer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140051408-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170113405-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10908381-B2 |
| priorityDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.