| abstract |
The present invention relates to a negative photosensitive resin composition, a) an ethylene-based oligomer or polymer resin; b) crosslinkable monomers having at least two ethylenic double bonds; And c) provides a non-solvent type negative photosensitive resin composition comprising a photopolymerization initiator. The composition of the present invention according to the above structure is an interlayer insulating film such as organic thin film transistor (OTFT), flexible display, organic electroluminescent device (OLED), electro-interlocking device (EPD), etc. It has excellent transmittance, chemical resistance and patterning, and minimizes the influence of the organic semiconductor film, which is a lower layer. |