| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_765b2652b97588d4372bb3841154f054 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-546
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-714 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 |
| filingDate |
2009-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65764541e3b74a3dfaf0c4a3d92a9c2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d3e6a3191ad8a9c4fcc2417ae0dbe33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04cc55df7bdb314d19ec6cf7befc0e67 |
| publicationDate |
2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100110563-A |
| titleOfInvention |
Flexible Copper Clad Laminates with Buffer Layer and Manufacturing Method Thereof |
| abstract |
The present invention relates to a flexible copper clad laminate (FCCL) having a buffer layer and a method of manufacturing the same. The present invention provides a flexible copper foil laminate and a method of manufacturing the same, wherein a buffer layer is formed of at least one surface of a polymer base substrate with a silicon compound or a similar silicon compound, and a copper foil layer is formed on the buffer layer. In the flexible copper foil laminate according to the present invention, since a buffer layer of a silicon compound or a similar silica compound is formed between the base substrate and the copper foil layer, the etching process for the copper foil layer is easily maintained while maintaining a good adhesion between the base substrate and the copper foil layer. It is possible to proceed, and solve the problem that the reliability of the product due to the insulation breakdown by ion migration. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160046171-A |
| priorityDate |
2009-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |