| abstract |
The present invention is represented by the following formula (1) on a substrate having a trench, a silicone resin composition containing a silicone resin and an organic solvent which is a solid at 120 ℃ is applied to fill the trench in the substrate to form a coating film, and then A method of forming trench isolation comprising performing a step of bringing the coating film into contact with at least one selected from the group consisting of water, alcohol and hydrogen peroxide, and at least one step selected from the group consisting of heat treatment and light treatment. . <Formula 1> (In Formula 1, n, m and k are each numbers, and when n + m + k = 1, n is 0 to 0.8, m is 0 to 1.0, and k is 0 to 0.2.) |