abstract |
The present invention is a curable resin composition containing a halogen-free flame retardant, a curable resin composition capable of forming a solder resist layer excellent in flame retardancy, low deformation, and insulation reliability, a dry film thereof, and flame retardant curing such as a solder resist by these. Provided is a printed wiring board on which a film is formed. Curable resin composition contains (A) carboxyl group-containing resin, (B) phosphorus containing compound, and (C) layered double hydroxide. In addition to each of the above components, by containing a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups in the molecule (D), a thermosetting resin composition can be obtained, and further (F) photopolymerization initiator and (G) By containing a photopolymerizable monomer, it can be set as the photocurable thermosetting resin composition. Preferably, it further contains (E) aluminum hydroxide. |