abstract |
The present invention is a curable resin composition containing a halogen-free colorant and a flame retardant, the curable resin composition having low deformation and capable of forming a solder resist layer excellent in concealability of poor appearance resulting from discoloration by oxidation of a copper circuit, It provides the dry wiring and the printed wiring board by which the flame-retardant hardening film, such as a soldering resist, is formed by these. Curable resin composition contains (A) carboxyl group-containing resin, (B) titanium oxide, and (C) aluminum hydroxide. In addition to each of the above components, by containing a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups in the molecule (D), a thermosetting resin composition can be obtained, and further (F) photopolymerization initiator and (G) By containing a photopolymerizable monomer, it can be set as the photocurable thermosetting resin composition. Preferably, it further contains (E) phosphorus containing compound. |