| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
2009-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcbb7c08d984ea08c1260694c226e4b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9117a0c32cd246cceaa315bccf842eab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25bd4e8ea82e490a03bdc4e8502d1e5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc783a9b709ce8ac61a1ace316f82c85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aff0adc24870e00c85eb18c2e6ec08b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a96995c0aa3c1ea3188020fefb41541a |
| publicationDate |
2010-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100102316-A |
| titleOfInvention |
Printed circuit board and manufacturing method thereof |
| abstract |
The present invention relates to a printed circuit board and a method of manufacturing the same.n n n A printed circuit board manufacturing method according to an embodiment includes preparing a raw material including a base metal layer on an insulating film and a conductive plating layer on the base metal layer; Forming a photosensitive resin pattern on the conductive plating layer; Selectively removing the conductive plating layer using the photosensitive resin pattern as a mask to form a circuit pattern; Selectively removing the base metal layer using the photosensitive resin pattern and the circuit pattern as a mask to form a base metal pattern; Removing the photosensitive resin pattern; And removing the insulating film exposed between the base metal patterns to a predetermined depth. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101235386-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101425559-B1 |
| priorityDate |
2009-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |