| abstract |
FIELD OF THE INVENTION The present invention relates to liquid agents for surface treatment of monocrystalline wafers, comprising alkaline etching agents and also at least one low-volatile organic compound. This type of system can be used for cleaning, damaging etch and texturing the wafer surface in a single etching step, as well as for texturing silicon wafers with different surface qualities, which results in high surface damage. It may be a wire-sawn wafer having a chemically polished surface with or with a minimum damage density. |