| abstract |
An object of the present invention is to provide a technique for forming a ULSI fine copper wiring by a simpler and easier method. An electronic member having an alloy thin film of tungsten and a noble metal, which is used as a barrier and seed layer for ULSI fine copper wiring, on the substrate, wherein the alloy thin film is 60 atomic% or more and tungsten 5 atomic% or more and 40 atomic% or less Electronic member which is composition to say. As said precious metal, 1 type, or 2 or more types of metals chosen from platinum, gold, silver, and palladium are preferable. |