| abstract |
Even when the particle diameter of the electroconductive particle contained in an anisotropic conductive film is small, it can be crushed uniformly and provides the electrical connection body which can acquire favorable conduction characteristic. The electrical connection body is comprised so that the semiconductor element 1 which is a 1st electronic member and the wiring board 3 which is a 2nd electronic member are electrically connected through the anisotropic conductive film 5. The bump (protrusion electrode) 2 is formed in any one electronic member (here, the semiconductor element 1), and the top part of the bump 2 is a flat surface whose surface roughness Ra is 0.05 micrometer or less. The average particle diameter of the electroconductive particle 6 contained in the anisotropic conductive film 5 is 4 micrometers or less. |