| abstract |
The present invention relates to a conductive electrode paste. Conductive electrode paste according to the present invention, 5 to 30 wt% of organic binder, 3 to 20 wt% of photopolymerizable monomer, 2 to 10 wt% of glass frit, 5 to 30 wt% of solvent, 40 to 80 wt% of spherical silver powder And 1 to 20 wt% of silver (Ag) coated plate-shaped copper (Cu) powder. As a result, the electrical conductivity of the electrode may be improved, and at the same time, the manufacturing cost of the panel may be reduced, and the problem of edge curl occurring during firing of the electrode may be reduced. |