| abstract |
A semiconductor power module package having a bonding area on a DBC substrate is disclosed.n n n The semiconductor power module package includes one or more semiconductor chips and a sealing member for sealing the semiconductor chips. A plurality of leads are electrically connected to the semiconductor chips and are exposed from the sealing member. External bonding members are exposed from the sealing member and electrically connected to the semiconductor chips to provide an electrical connection with an external circuit board. |