| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32ce12f8709350afe097badddf523729 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0277
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate |
2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_758193a6863c3ba72085fe178e11dcd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d01994ac4f92e3e79749d5a1ee8d5d86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ec2ceb2ea0b26ae3b3a6efea36af6bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4c878ce3b8ecc3d3bd390b39dc4ca23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_247520d16e3e3673ad6d67c5273332cd |
| publicationDate |
2010-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100063748-A |
| titleOfInvention |
Polyamide resin, photosensitive resin composition, formation method of hardening relief pattern, and semiconductor device |
| abstract |
The photosensitive resin composition which is excellent in the photosensitive characteristic and gives outstanding film | membrane characteristic even when a resin film is formed on heat-hardening conditions like 200 degrees C or less, for example, and the polyamide resin used for this are provided. The present invention is the following formula (1): In the formula, X is a trivalent organic group having 6 to 15 carbon atoms, m is 0 or 2, and Y is a divalent organic group having 6 to 35 carbon atoms when m = 0, and a carbon number when m = 2 It is a tetravalent organic group which is 6-35, R < 1> is the aliphatic group which has at least 1 C5-C20 radically polymerizable unsaturated bond group which may contain atoms other than carbon, and repeats the structural unit represented by The polyamide resin is contained so that the number of repetitions may be in the range of 80 to 100% of the total number of all the structural units which comprise a polyamide resin within the range of numbers 2-150. |
| priorityDate |
2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |