| abstract |
A semiconductor package having bond fingers formed at different levels of a printed circuit board is provided. The apparatus includes a printed circuit board having first bond fingers formed in a bond finger region and second bond fingers formed at a different level than the first bond fingers. The first bond fingers and the second bond fingers are alternately arranged one by one. A semiconductor chip is provided adjacent to the first and second bond fingers. Electrical interconnections are formed between the first and second bond fingers and the semiconductor chip. |