| abstract |
The present invention is at least one selected from the group consisting of (i) a reactive hydroxyl group-containing polyamide resin, (ii) an epoxy resin having a polycondensate skeleton of dicyclopentadiene and phenol, a phenol aralkyl skeleton and a biphenol aralkyl skeleton The present invention relates to a thermosetting resin composition comprising an epoxy resin, and (iii) at least one epoxy resin curing agent selected from the group consisting of phenolic compounds having the same skeleton as the epoxy resin, which can be cured at a low heat treatment temperature, In addition, the cured product has high heat resistance and high adhesive strength over a wide temperature range. Therefore, the resin composition is useful as an adhesive, an insulation protective material, etc. used for electrical and electronic materials, such as a flexible wiring board and a laminated board. |