http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100055396-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4308752e855a46f4a236d7230610c13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c37617a935280e521bc8a0e2185ad8c |
| publicationDate | 2010-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100055396-A |
| titleOfInvention | Liquid resin composition for adhesives, semiconductor device, and manufacturing method of semiconductor device |
| abstract | Containing at least a solvent (A), an epoxy resin (B) having two or more epoxy groups in one molecule, an epoxy resin curing agent (C) having two or more phenolic hydroxyl groups in one molecule, and a curing accelerator (D) As the liquid resin composition for adhesives, the said epoxy resin (B) and the said epoxy resin hardener (C) are melt | dissolved in the said solvent (A), and the said hardening accelerator (D) volatilizes the said solvent (A) from normal temperature. In the temperature range to a temperature to make it, in the varnish W which melt | dissolved the said epoxy resin (B) and the said epoxy resin hardening | curing agent (C) in the said solvent (A), and from said varnish (W) the said solvent (A) In the adhesive layer obtained by volatilizing, it exists in the magnitude | size which can be observed visually, and the magnitude | size which cannot be observed visually in the temperature range from the temperature higher than the temperature which volatilizes the said solvent (A) to hardening temperature Or above It is a liquid resin composition for adhesives which melt | dissolves in an adhesive bond layer. ADVANTAGE OF THE INVENTION According to this invention, the liquid resin composition for adhesives which is excellent in continuous printability at the time of printing, and has favorable semiconductor element mounting property after solvent volatilization, and is not sticky at room temperature can be provided. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102078371-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015053453-A1 |
| priorityDate | 2007-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.