| abstract |
The present invention relates to a positive photosensitive resin composition, comprising: (A) a polyimide-polybenzoxazole alternating co-polymer precursor having a repeating unit represented by the following formula (1) or (2): ; (B) photosensitive diazoquinone compound; (C) silane compound; (D) phenolic compounds; And (E) relates to a positive photosensitive resin composition comprising a solvent.n n n [Formula 1]n n n n n n n n [Formula 2]n n n n n n n n (In the formulas (1) and ( 2) , the definitions of X 1 , X 2 , Y 1 , Y 2 , Z 1 , and Z 2 are as described in the detailed description of the specification.)n n n The positive photosensitive resin composition of the present invention includes both a polyimide structure having excellent mechanical properties and a polybenzoxazole structure having excellent optical properties such as high sensitivity, high resolution, good pattern shape, excellent residue removal property, and low film reduction rate. It is possible to provide a post-curing film exhibiting excellent mechanical properties and heat resistance while maintaining photosensitivity. |