http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100054152-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10cfc10171f0e204339e96e62a544ce0 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2008-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100e7d526cf8ae65dd50698a5c9a49b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3118ef266ae55ee177a4b1c3921a70ac |
| publicationDate | 2010-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100054152-A |
| titleOfInvention | Polishing composition |
| abstract | An object of the present invention is to provide a polishing composition capable of improving the flatness while achieving a high polishing rate. The polishing composition of the present invention is a polishing composition which is very suitable for metal films, especially copper (cu) films, and contains an alkaline compound containing an ammonium group, an alkylnaphthalene sulfonate and hydrogen peroxide, and the balance is water. As an adaptation range of pH, it is 8-12. By including these, it is possible to realize a polishing composition capable of improving flatness while achieving a high polishing rate. |
| priorityDate | 2007-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.