| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2079-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2008-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_391f8b66f4823d5d66ac9fcc60643308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a426a5a2bed30320892b3b030712c17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f6ea51600d7434671ebdd74588a5d65 |
| publicationDate |
2010-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100050529-A |
| titleOfInvention |
Polyimide film and wiring board |
| abstract |
There is provided a polyimide film for use in the manufacture of a wiring board in which the wiring board is formed by laminating a metal layer on one side (B surface) and etching the metal layer. The film is curled toward the opposite side of the B side (A side) and the curl of the polyimide film is controlled so that the deflection of the wiring board is reduced when the metal wiring is formed. The handling and productivity at the time of IC chip mounting are improved by using such a polyimide film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140037925-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140037926-A |
| priorityDate |
2007-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |