| abstract |
The present invention mounts an LED chip that emits first light on a bottom surface of a recess formed on an upper surface of a package, and contains a resin liquid containing phosphor particles that emit second light when the first light is incident into the recess. Inject Next, the package is set on the package fixing plate of the LED device manufacturing apparatus, and by rotating the rotating member by the rotation driving unit, centrifugal force is applied from the upper surface of the package toward the lower surface to forcibly settle the phosphor particles in the resin liquid. . Thereafter, the resin liquid is cured. Thus, LED devices are manufactured. |