http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100045909-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73c889509e25533917be14ef79530040 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-0595 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 |
| filingDate | 2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f095ca8f92eeaeae90136b2a3f1d6b83 |
| publicationDate | 2010-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100045909-A |
| titleOfInvention | Package for electronic parts, piezoelectric device and manufacturing method thereof |
| abstract | An electronic component package in which a solid, spherical sealing material is disposed in the sealing hole, the sealing material is melted, and the sealing of the electronic component is hermetically sealed; a piezoelectric device that realizes stable vibration characteristics and high reliability using the electronic component package; The manufacturing method is provided.n n n In the crystal oscillator 1 which hermetically sealed the quartz crystal vibrating element 25 in the internal space formed by the lead substrate 10 and the base substrate, the sealing hole 40 provided in the lead substrate 10 as one board | substrate. ) Is a through passage communicating the outer surface 11 of the lead substrate 10 with the concave bottom surface of the concave portion 13 as the surface on the inner space side, and has a seal with an opening in the outer surface 11. The hemispherical outer side recessed part 41 which has the curved surface extended in the penetrating direction and the inner circumferential direction of the ring hole 40, and the inner space side recessed part 42 which has the opening part 42b in the inner space side are the outer sides. It communicates with the opening part 42a formed in the recessed bottom part of the recessed part 41. FIG. The metal film 43 is formed in the area | region including the inner wall of the outer side recessed part 41. FIG. |
| priorityDate | 2008-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.