| abstract |
The present invention relates to a positive photosensitive resin composition, wherein the positive photosensitive resin composition (A) has a repeating unit represented by the following general formula (1), and at least one monocarboxylic acid halide having a carbon-carbon multiple bond at one end portion thereof. Polybenzoxazole precursors having thermally polymerizable functional groups derived from; (B) photosensitive diazoquinone compound; (C) silane compound; (D) phenolic compounds; And (E) a solvent.n n n [Formula 1]n n n n n n n n (In Formula 1, the definition of each substituent is the same as that described in the specification.)n n n Positive type photosensitive resin composition of the present invention can form cross-linking efficiently during thermosetting, can lower the molecular weight of the polymer before curing, exhibits excellent mechanical properties of the film after curing, good resolution and pattern shape, excellent residual Water removal, low hygroscopicity, and low membrane shrinkage. |