http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100040168-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2008-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14135fe8d16796579c7e26dea5ae9bf5 |
| publicationDate | 2010-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100040168-A |
| titleOfInvention | Method for forming metal wire |
| abstract | PURPOSE: A method for forming a metal wire is provided to simplify the wire formation process by including a copper deposition process and a lift-off process. CONSTITUTION: An oxide layer(310) is formed on a structure. A photo resist layer is coated on the oxide layer. A photo resist pattern is formed by an exposure processing with a mask(320). The oxide layer is patterned using the photo resist pattern as an etching mask. A copper wire(340) is formed on the etched space of the oxide pattern(310a). A lift-off process is performed on the patterned oxide layer. The oxide layer is removed. |
| priorityDate | 2008-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.