| abstract |
The present invention relates to a positive photosensitive resin composition, wherein the positive photosensitive resin composition comprises (A) a polyamide polymer represented by the following formula (1), (B) an esterified quinonediazide compound, and (C) a phenol group-containing compound , And (D) a solvent.n n n [Formula 1]n n n n n n n n (In the above formula, the definition of each substituent is the same as defined in the specification.)n n n The positive photosensitive resin composition of this invention is excellent in heat resistance, and can form a fine pattern of high sensitivity and high resolution. |