abstract |
The present invention relates to a method for manufacturing a double-sided printed circuit board having a circuit pattern by printing a conductive paste, it is possible to form a circuit pattern of high precision and high conductivity, while reducing raw materials, process shortening, etc., printing the conductive paste The present invention relates to a method for manufacturing a double-sided printed circuit board in which the conductive layer is not short-circuited even by bending, heat, or physical impact.n n n n Duplex, Printed Circuit Board |