| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0218 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B17-64 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2008-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31d3c6351ee306fb286f9ae17acdfd68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e24c5bc90ebf682c55a1980eea8c156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dad8bae74be06b33bc72bba5eb59da65 |
| publicationDate |
2010-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100031103-A |
| titleOfInvention |
Electroconductive fine particles, anisotropic conductive material, and bonded structure |
| abstract |
An object of this invention is to provide electroconductive fine particles which can reduce connection resistance value and can implement | achieve high connection reliability. Moreover, an object of this invention is to provide the anisotropic electrically-conductive material and bonded structure which use this electroconductive fine particle.n n n In the present invention, a metal layer containing nickel or palladium on the surface of the resin fine particles, and a low melting metal layer containing at least one group 13 element selected from the group consisting of a low melting metal, thallium, indium and gallium are sequentially As electroconductive fine particles laminated | stacked, content of the said group 13 element in the total of the metal contained in the said low melting-point metal layer is electroconductive fine particles which are 0.01-6 weight%. |
| priorityDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |