abstract |
The present invention comprises a glass fiber fabric and a cured product of a silicone resin composition filled in the glass fiber fabric and covering the surface of the glass fiber fabric, wherein the composition is an organo resin having a resin structure comprising (A) specific siloxane units. Provided are a silicon laminate substrate comprising a polysiloxane, (B) an organohydrogenpolysiloxane having a resin structure composed of specific siloxane units, (C) a platinum group metal catalyst, and (D) a filler. The silicon laminated substrate is excellent in mechanical properties, flexibility, and workability, has little adhesion on the surface, and is easy to handle. The silicon laminated substrate is impregnated with a glass fiber fabric in a state in which the composition is dissolved and dispersed in a solvent, the solvent is evaporated and removed from the glass fiber fabric, and the composition impregnated with the glass fiber fabric is subjected to pressure molding. It is prepared by heat curing. From the said silicon laminated board | substrate for LED devices, the LED device provided with the said board | substrate and the LED chip mounted on the said board | substrate is obtained. n n Silicon laminated substrate, manufacturing method of silicon laminated substrate, silicone resin composition for silicon laminated substrate manufacture, LED apparatus |