Electromagnetically-resistant flexible wiring interconnects, nano-sized solder components, systems of these, and methods of assembling soldered packages
Nano-sized metal particle composites include a first metal having a particle size of about 50 nanometers or less. The wiring interconnect is in contact with the reflowed nanosolder and has the same metal or alloying component as the reflowed nanosolder. Microelectronic packages using reflowed nanosolder components are also disclosed. The method of assembling the microelectronic package includes preparing a wiring interconnect template. The computing system includes a nanosolder component coupled to the wiring interconnect.