| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51fc8a3c9afd9578fa9714e5767b6524 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2008-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b046dc39b26820aeb242f8a4c983957
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fc7db2ed992303e2bdea02251007d37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef587031c54e2b6edad05df42618f0de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ad2b669735a9feaa7ae19ce52b45d02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44721216e2b0366b72d724e7e5be4284 |
| publicationDate |
2010-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100020307-A |
| titleOfInvention |
Memory module temperature test device |
| abstract |
Memory module temperature test apparatus according to the present invention, the body unit is installed on the memory module of the main board so as to surround only the memory module mounted on the main board and having a closed structure when installed on the main board, and the body unit It is installed on one side of the heat exchange unit including a thermoelectric module for heating or cooling the inside of the body unit, and electrically connected to the thermoelectric module includes a control unit for controlling the thermoelectric module to heat or cool the inside of the body unit to the desired temperature conditions . This makes it possible to perform high and low temperature tests as well as low temperature tests on a single memory module temperature test device, thereby eliminating the problem of having to move test sites according to existing temperature conditions. It can be performed to improve the reliability of the memory module. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102131954-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102073659-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150135259-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220030617-A |
| priorityDate |
2008-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |