http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100018011-A

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filingDate 2010-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e8fbd46be9665660656b6d8fe3e05ef
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publicationDate 2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20100018011-A
titleOfInvention Plating apparatus for forming amorphous trivalent chromium alloy plating layer and trivalent chromium alloy plating solution
abstract The present invention relates to an alloy plating layer for forming a pure trivalent chromium alloy plating layer, and more specifically, does not include allergic metals such as nickel (Ni) and cobalt (Co) and harmful metals and toxic cyanide (CN). The present invention relates to a plating apparatus capable of forming an amorphous trivalent chromium alloy plating layer containing trivalent chromium having excellent adhesion to a trivalent chromium plating layer, corrosion resistance and abrasion resistance, and a trivalent chromium alloy plating solution thereof. The present invention has a square having a cathode line 11 connected to a conductor 12 having a copper plating layer a formed at an inner center thereof, and an insoluble anode 14 connected to an anode line 13 at an outer side thereof. An electroplating tank 10 in drum form; The cathodic portion 10a formed at the inner center of the electroplating tank 10 and the anode portion 10b formed at the outer side of the electrolytic plating tank 10 are separated, and the dilute sulfuric acid solution 60 and the insoluble anode (the insoluble anode 14) A semi-permeable ion diaphragm 20 which differentiates and passes only ions generated by electrolysis with 14); Plates 30 formed on both sides of the ion diaphragm 20 to support the ion diaphragm 20; A rectifier 40 connected to the cathode line 11 and the anode line 13 to supply power; An open plating apparatus configured to fill the negative electrode portion 10a with a trivalent chromium alloy plating solution 50 containing chromium and phosphorus, and to fill the positive electrode portion 10b with a diluted sulfuric acid solution 60; The trivalent chromium alloy plating solution 50 is 34 wt% to 55 wt% chromium chloride, 6 wt% to 27 wt% glycine, 2 wt% to 13 wt% sodium hypophosphate, 11 wt% to 27 wt% ammonium sulfate , Boric acid 4 wt% to 11 wt%. Through the present invention, it is possible to form an amorphous trivalent chromium alloy plating layer composed of trivalent chromium, phosphorus and carbon having excellent adhesion to the pure trivalent chromium plating layer, corrosion resistance, and abrasion resistance on the copper plating layer formed on the object through the bar. It is possible to form a pure trivalent chromium plating layer without using cobalt and cyanide material, and thus it is possible to provide an environmentally friendly amorphous trivalent chromium alloy plating layer and does not generate toxic cyanide wastewater, but also generates trivalent valent wastewater. It is very convenient to manage chromium alloy plating solution.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200121618-A
priorityDate 2010-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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