| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2007-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deb5d6fd68c24c65026d0a6744b37d20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66888446ea4fe0a9294689218b837878
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27a66d93180ef6de6bd9b308608fe049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90f37a8576aedbd85d46b86d0a8b142e |
| publicationDate |
2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100017562-A |
| titleOfInvention |
Electric copper plating bath |
| abstract |
An electrocopper plating bath used to fill unopened pores formed on a substrate with copper, containing brightener, carrier and leveler as water-soluble copper salts, sulfuric acid, chloride ions and additives, wherein the leveler cationicizes in solution. An electrocopper plating bath comprising at least one water-soluble polymer containing primary nitrogen, tertiary nitrogen or both. The copper plating filling of the electro-copper plating bath for filling the unthrough holes formed on the substrate by copper plating only changes the ratio of the quaternary nitrogen and the tertiary nitrogen of the water-soluble polymer which is a leveler. It can be easily adjusted to fit the size and can be electroplated to match the unthrough holes of various sizes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9562299-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140044280-A |
| priorityDate |
2007-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |