| abstract |
The two-beam laser output, preferably derived from a single laser beam, improves the quality of the sidewalls of the vias perforated in the target material, such as a printed circuit board comprising fiber-reinforced resin. Each of the two embodiments removes a portion 14 of the target material 18 from the target material location of the workpiece 12 and removes residues of the target material bonded to the metal layer below the target material location at a material removal rate. Two laser power components are used for rapid cleaning. The first embodiment targets a treatment laser output having a first component and a second component characterized by a first wavelength and a second wavelength λ 1 , λ 2 , respectively, for incidence over a portion of the target material. It involves directing the position. The second embodiment is directed to directing a processing laser output having a first component and a second component to a target material location for incidence onto a portion of the target material, respectively, characterized by a first pulse width and a second pulse width. Entails. |